Vivo Explains How The 3.75mm X5 Max Smartphone Got So Thin | TechTree.com

Vivo Explains How The 3.75mm X5 Max Smartphone Got So Thin

We wonder how well it will withstand the standard bend test considering its wafer thin dimensions.

 

Seems like Apple has a lot to work on with its upcoming iPhone. This is because Vivo has been teasing us with images of its unbelievably thin X5 Max smartphone that will clearly break a world record. The smartphone will make the current record holder, the OPPO R5 go on a diet as it measures in at just 3.75mm in overall thickness.

Vivo explains that building a smartphone this thin was a challenge indeed. But they found a way out by pushing all the components like the chipsets (786 in all) to the sides of display. In this way the display literally sits flat on back panel, making this amazingly thin construction possible.

Leaked images show how thin this smartphone really is. In fact, Vivo had to drop the 3.5 mm headphone jack and the memory card slot to achieve this thinness. The smartphone uses a microUSB 3.5 mm converter and Vivo will hopefully pair a good set of Bluetooth headphones to go with it.

Strangely though TENAA says that the handset does come with a 3.5 mm headset jack and there are some more details about the specifications:

  • There is a 5.5 inch screen of 1080p resolution
  • Inside we get a 1.7 GHz octa-core MediaTek chipset with 2 GB of RAM
  • Behind sits a 13 MP camera module with a 5 MP front facing unit for selfies

As for the rest of the details, we will get them next month when the Vivo X5 Max gets announced officially.

Source 1, Source 2


TAGS: Mobile Phones, Android, Vivo X5 Max, Vivo

 
News Corner
IMP IMP IMP
##