Via Technologies has unveiled the Via VX700 chipset for the Via Ultra Mobile platform in UMPC (Ultra Mobile PC) that will enable reduction of mobile form factors by up to 40 percent.

UMPC is a new category of devices that can fit comfortably into a pocket or handbag. According to Via, VX700 will enable smaller form factor "computing" devices with reduced power consumption and enhanced functionality.

Commenting on VX700, Chinhwaun Wu, special assistant to president, processor platform product marketing, Via Technologies, said, "The Via VX700 sets a new industry milestone for functionality and performance in a single chipset package. Together with the Via C7-M processor, Via can now offer a platform that breaks form factor barriers while maintaining comprehensive performance, a leading feature set, and ultra-low power operation for longer battery life."

DualCor Technologies' cPC is a UMPC that brings together all the capabilities of a PC and a mobile communications device in a sleek but rugged, handheld form factor.

Rob Howe, president, DualCor Technologies, said, "The Via VX700 chipset together with the Via C7-M ULV processor has enabled us to create a new convergence device that combines the convenience of a digital communications device, with the power of a conventional PC in a thin, elegant machine. The Via Ultra Mobile platform, featuring the Via VX700, has been critical in helping us achieve the cPC's small size and enhanced battery life, while still providing the performance that today's mobile user needs for everyday PC tasks."

According to Via, the VX700 is designed specifically for today's ultra thin 'n' light notebooks and ultra mobile devices. It integrates all the cutting-edge features of a modern chipset's North and South bridges, into a single chip package measuring just 35mm x 35mm that generates a silicon real estate saving of over 42 percent.

The Via VX700 features enhanced video quality through Via UniChrome Pro II IGP core with its 128-bit 2D/3D graphics; powerful image enhancement technology delivering a HD visual experience including advanced video acceleration for MPEG-2, MPEG-4, and WMV9; and memory controller technology with support for both DDR and the latest low power high-bandwidth DDR2 memory modules, etc.

The new chipset also has an integrated Via Vinyl HD Audio controller that supports up to eight high definition channels, delivering a richer digital media experience. The chipset includes support for SATA II and PATA drives, six USB2.0 ports, and four PCI slots. It provides extended flexibility to display technologies, with integrated multi-configuration LVDS/DVI transmitter for connection to LCD, and CRT/HDTV interfaces.

The Via VX700 will be priced at around $35 (Rs 1,600), and is expected to be available in volume quantities later in Q3 2006.